SK hynix advanced at the sharpest pace this year on the stock market on Thursday as it began the mass production of 12-layer high bandwidth memory (HBM) chips.

The world's second-largest memory chipmaker SK Hynix said on Thursday it began mass production of a 12-layer version of the latest generation of high-bandwidth memory (HBM) chips, to meet demand from the current AI boom.

SK Hynix Inc. announced today that it has begun mass production of the world's first 12-layer HBM3E product with 36GB [i], the largest capacity of existing HBM [ii] to date. 1Previously, the maximum capacity of HBM3E was 24GB from eight vertically stacked 3GB DRAM chips.