The South Korean giant has been a main supplier of the high-bandwidth memory chips catering to AI chipsets for companies like Nvidia.

The world's second-largest memory chipmaker SK Hynix said on Thursday it began mass production of a 12-layer version of the latest generation of high-bandwidth memory (HBM) chips, to meet demand from the current AI boom.

SK Hynix’s shares surged by more than 9% on Thursday as the South Korean company commenced mass production of its most advanced high-bandwidth memory (HBM) chips, known as HBM3E. These chips, featuring 12 layers and a 50% larger capacity than the previous generation,

The South Korean tech giant revealed it has started mass production of the world’s first 12-layer version of its HBM3E chips, marking a significant step forward in the race to develop advanced memory solutions for artificial intelligence (AI) applications.

SK hynix Inc. has commenced mass production of its 12-layer High Bandwidth Memory 3E (HBM3E) modules, featuring a total capacity of 36 GB. This marks the largest capacity achieved in HBM technology to date.

DRAM chip SK hynix has announced the mass production of the 12-layer HMB3E with 36GB capacity, promising to supply it to customers within the year. The new 12-layer HBM3E, according to SK hynix, will meet the world's highest standards in areas,

SK hynix's stock jumped about 9% on Thursday on the Korea Exchange after the company said it began mass production of the world's first 12-layer HBM3E product with 36GB capacity, the largest capacity of existing HBM to date.